"Meter-scale heterostructure printing for high-toughness fiber electrodes in intelligent digital apparel"

G.-H. Lee, Y. Lee, H. Seo, K. Jo, J. Yeo, S. Kim, J.-Y. Bae, C. Kim, C. Majidi, J. Kang, S.-K. Kang, S. Ryu, S. Park*, Nature Communications, 2025, 16, 4320

"Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer"

H. Seo, G.-H. Lee, J. Park, D.-Y. Kim, Y. Son, S. Kim, K. Nam, C. Yang, J. Won, J.-Y. Bae, H. Kim, S.-K. Kang, S. Park, J. Kang*, S. Park*, Nature Communications, 2025, 16, 4944

"Miniature Li+ solvation by symmetric molecular design for practical and safe Li-metal batteries"

J. Jang†, C. Wang† , G. Kang, C. Han, J. Han, J.-S. Shin,  S. Ko , G. Kim, J. Baek, H.-T. Kim , H. Lee, C. B. Park, D.-H. Seo, Y. Li*,  J. Kang *, Nature Energy, 2025,

"Self-healing electronic skin with high fracture strength and toughness"

J. Jung, S. Lee, H. Kim, W. Lee, J. Chong, I. You, J. Kang*, Nature Communications, 2024, 15, 9763

"A Pressure-Sensitive, Repositionable Bioadhesive for Instant, Atraumatic Surgical Application on Internal Organs"

K. S. Nam, Y. Kim, G. Park, K. Hwang, M. Kim, J. Chong, J. Jeon, C. Yang, Y. H. Lu, C. Paniccia, J. Choi, D. G. Kim, H. Lee, S. W. Oh, S. Kim, J.‐W. Rhyu, J. Kang, J. K. Hyun, J. M. Karp, Y. Lee*, H. Yuk*, S. Park*, Advanced Materials, 2024, 2407116

"Enhanced Free Li-Ion Mobility in Solid-State Electrolytes via Long-Range Assembly of Porous Materials"

G.H. Kim, J. Jang, J. Kang*, ACS Applied Materials & Interfaces, 2024, 16 (28), 36479−36488

"Self-Healing Materials for 3D Printing"

A. Andreu, H. Lee, J. Kang*, Y. J. Yoon*, Advanced Functional Materials, 2024, 2315046

"Divide and Conquer: Design of Gallium-Based Liquid Metal Particles for Soft and Stretchable Electronics"

G. Park, G. H. Lee, W. Lee, J. Kang*, S. Park*, S. Park*, Advanced Functional Materials, 2023, 2309660,

"Toughening self-healing elastomer crosslinked by metal–ligand coordination through mixed counter anion dynamics"

H. Park, T. Kang, H. Kim, J. C. Kim, Z. Bao, J. Kang*, Nature Communications, 2023, 14 (5026),

"Large-area photo-patterning of initially conductive EGaIn particle-assembled film for soft electronics"

G. H. Lee†, H. Kim†, J. Lee, J. Y. Bae, C. Yang, H. Kim, H. Kang, S. Q. Choi, S. Park, S. K. Kang, J. Kang, Z. Bao, J. W. Jeong*, Steve Park*, Materials Today, 2023,

"Human hand-inspired all-hydrogel gripper with a high load capacity formed by the split-brushing adhesion of diverse hydrogels"

H. B. Koo, E. Heo, I. Cho, S. H. Kim, J. Kang, J. B. Chang*, Materials Horizons, 2023, 10, 2075-2085

"Environmentally stable and stretchable polymer electronics enabled by surface-tethered nanostructured molecular-level protection"

Y. Zheng, L. Michalek, Q. Liu, Y. Wu, H. Kim, P. Sayavong, W. Yu, D. Zhong, C. Zhao, Z. Yu, J. A. Chiong, H. Gong, X. Ji, D. Liu, S. Zhang, N. Prine, Z. Zhang, W. Wang, J. B.-H. Tok, X. Gu, Y. Cui, J. Kang , Z. Bao*, Nature Nanotechnology, 2023, 18, 1175–1184

"Highly conductive tissue-like hydrogel interface through template-directed assembly"

J. Chong†, C. Sung†, K. Nam, T. Kang, H. Kim, H. Lee, H. Park, S. Park*, J. Kang*, Nature Communications, 2023, 14 (1), 2206

"3D Shape-Morphing Display Enabled by Electrothermally Responsive, Stiffness-Tunable Liquid Metal Platform with Stretchable Electroluminescent Device"

S. Oh, S. Lee, S. H. Byun, S. Lee, C. Y. Kim, J. Yea, S. Chung, S. Li, K. I. Jang, J. Kang*, J. W. Jeong*, Advanced Functional Materials, 2023, 2214766

"Technology Roadmap for Flexible Sensors"

Y. Luo, M. R. Abidian, J. H. Ahn, D. Akinwande, A. M. Andrews, M. Antonietti, Z. Bao, ... , J. Kang, ... , X. Chen* and 133 others, ACS Nano, 2023, 17 (6), 5211–5295