Large-area photo-patterning of initially conductive EGaIn particle-assembled film for soft electronics

Author

G. H. Lee†, H. Kim†, J. Lee, J. Y. Bae, C. Yang, H. Kim, H. Kang, S. Q. Choi, S. Park, S. K. Kang, J. Kang, Z. Bao, J. W. Jeong*, Steve Park*

Journal

Materials Today

Year

2023

Link

https://doi.org/10.1016/j.mattod.2023.05.025 4664회 연결

• 이전글Toughening self-healing elastomer crosslinked by metal–ligand coordination through mixed counter anion dynamics 23.08.21
• 다음글Human hand-inspired all-hydrogel gripper with a high load capacity formed by the split-brushing adhesion of diverse hydrogels 23.08.21