Universal assembly of liquid metal particles in polymers enables elastic printed circuit board

Author

W. Lee†, H. Kim†. I. Kang, H. Park, J. Jung, H. Lee, H. Park, J. Park, J. Yuk, J. W. Jeong, J. Kang*

Journal

Science

Status

front cover selected

Vol

378

Page

637

Year

2022

Link

https://www.science.org/doi/10.1126/science.abo6631 5742회 연결

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