Publication

Dynamic Materials Design Laboratory

Publication

Publication

F4‐TCNQ as an Additive to Impart Stretchable Semiconductors with High Mobility and Stability
Author
J. Mun, J. Kang, Y. Zheng, S. Luo, Y. Wu, H. Gong, J. C. Lai, H. C. Wu, G. Xue, J. B. Tok*, Z. Bao*
Journal
Advanced Electronic Materials
Vol
6
Page
2000251
Year
2020

F4‐TCNQ as an Additive to Impart Stretchable Semiconductors with High Mobility and Stability | Advanced Electronic Materials